Drilling plastics with ultra-short UV laser pulses without thermal damage
Fraunhofer ILT has developed a special UV microscanner that can be used to flexibly create micro- and nanostructures and drill holes in various materials. It uses aThe wavelength in the UV range that significantly improves absorption, especially in dielectrics such as plastics. This way, it can drill micro- and nanometer holes in polymer films such as PC, PE, PI and PP with high precision and reproducibility. Even with thermally sensitive plastic films with a thickness <15 µm and high hole density, there is no thermal deformation. Thanks to the adjustable Since the focus diameter can be adjusted, from 6.0 down to 0.5 µm, even hole diameters in the sub-µm range can be produced.